INTRODUCTION

2018 The 2nd International Conference on Telecommunications and Communication Engineering aims to bring together researchers and practitioners from academia and industry to discuss latest progress and development in this fields. ICTCE 2018 would be the international platform for knowledge sharing as well as creating favorable atmosphere for collaboration initiations. This event will include contributions by renowned plenary and invited speakers, oral presentations, posters sessions and technical exhibition that relate to the topics dealt with in the Scientific Program.

We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event, which will be launched in Beijing, China, during November 28-30, 2018.

ICTCE 2017 proceedings was successfully indexed by EI Compendex.Good News

 



OPPORTUNITIES
FOR PUBLICATION

We recognizes that not every paper will necessarily contain new theoretical results or new algorithms, and strongly encourages the submissions that provide new models and analyses that are rigorously validated through implementation and experimentation. We will make every effort to fairly review papers with a systems focus.

Papers submitted via the Electronic Submission System. Or submit directly to ictce@academic.net.

Publication:

Registered and presented papers will be published into the conference proceedings, which will be included in the major database, Scopus, Ei compendex, google scholar, etc.

OPPORTUNITIES
FOR SPONSORSHIP 

Dinner sponsorhip (USD 4,000):

  • One exhibition booth (3m x 3m) for all three days (November 28-30, 2018).  All booths will be placed in the tea breaks and poster area, to maximize interactions with all participants during tea break and poster viewing sessions.
  • Waived registration fee and a 3-nights accommodation at the conference venue hotel, for 2 company staffs
  • Banners of dinner sponsorship will be placed in conference venue and dinner venue
  • Company logo will be included in all promotional materials (website, program and abstract books, conference bags, etc)

Lunch sponsorship for Young Scientists (USD 1,400):

  • One exhibition booth (3m x 3m) for all three days (November 28-30, 2018). All booths will be placed in the tea breaks and poster area, to maximize interactions with all participants during tea break and poster viewing sessions.
  • This is to sponsor lunch for these Young Scientists.
  • Banners of lunch sponsorship will be placed in conference venue and lunch venue
  • Company logo will be included in all promotional materials (website, program and abstract books, conference bags, etc)

We welcome all levels of sponsorship. We welcome your queries and participation, and we look forward to have you as a part of this exciting event. Thank you.


IMPORTANT DATES

15th June 2018
Submission of Abstract/Full Paper

Before 5th July 2018
Notification of Acceptance

Before 25th July 2018
Final Registration Deadline

25th July 2018
Camera Ready, no opportunity to revise your paper after this date

 


LATEST NEWS

April 1st, 2018
Welcome IEEE Fellow Prof. Moshe Zukerman from City University of Hong Kong to deliver a speech.

 


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