INTRODUCTION | 会议简介
2018 The 2nd International Conference on Telecommunications and Communication Engineering aims to bring together researchers and practitioners from academia and industry to discuss latest progress and development in this fields. ICTCE 2018 would be the international platform for knowledge sharing as well as creating favorable atmosphere for collaboration initiations. This event will include contributions by renowned plenary and invited speakers, oral presentations, posters sessions and technical exhibition that relate to the topics dealt with in the Scientific Program.
We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event, which will be launched in Beijing, China, during November 28-30, 2018.
ICTCE 2017 proceedings was successfully indexed by EI Compendex and Scopus.
2018年第二届电信和通信工程国际会议旨在汇集学术界和业界的研究人员和从业人员，共同讨论这一领域的最新进展。 ICTCE2018将为各位专家学者提供一个知识共享的国际平台，并为领域内相关合作创造有利的氛围。 本次大会将包括特邀发言，口头发言，海报会议和主题相关的学术参观。
大会诚邀您提交摘要或论文，并于2018年11月28日至30日在中国北京北邮科技酒店参与讨论。ICTCE2017会议论文集已成功EI核心检索和scopus检索。(查看)
OPPORTUNITIES
FOR PUBLICATION | 论文出版
Conference Proceedings:
Registered and presented papers will be published into International Conference Proceedings Series by ACM (ISBN: 978-1-4503-6585-7), which will be included in the major database, EI Compendex, Scopus, Google Scholar, etc.
We recognizes that not every paper will necessarily contain new theoretical results or new algorithms, and strongly encourages the submissions that provide new models and analyses that are rigorously validated through implementation and experimentation. We will make every effort to fairly review papers with a systems focus.
Papers submitted via the Electronic Submission System. Feel free to contact us via ictce@academic.net if you encounter any problem when submit a paper. 请将您的摘要或论文投递至电子系统。如您在投稿中遇到问题，请及时联系会议邮箱。
OPPORTUNITIES
FOR SPONSORSHIP | 赞助我们
Dinner sponsorhip (USD 4,000):
- One exhibition booth (3m x 3m) for all three days (November 28-30, 2018). All booths will be placed in the tea breaks and poster area, to maximize interactions with all participants during tea break and poster viewing sessions.
- Waived registration fee and a 3-nights accommodation at the conference venue hotel, for 2 company staffs
- Banners of dinner sponsorship will be placed in conference venue and dinner venue
- Company logo will be included in all promotional materials (website, program and abstract books, conference bags, etc)
Lunch sponsorship for Young Scientists (USD 1,400):
- One exhibition booth (3m x 3m) for all three days (November 28-30, 2018). All booths will be placed in the tea breaks and poster area, to maximize interactions with all participants during tea break and poster viewing sessions.
- This is to sponsor lunch for these Young Scientists.
- Banners of lunch sponsorship will be placed in conference venue and lunch venue
- Company logo will be included in all promotional materials (website, program and abstract books, conference bags, etc)
We welcome all levels of sponsorship. We welcome your queries and participation, and we look forward to have you as a part of this exciting event. Thank you.
IMPORTANT DATES
10th October 2018
Submission of Abstract/Full Paper
Before 20th October 2018
Notification of Acceptance
Before 31st October 2018
Final Registration Deadline
Download Conference Flyer
LATEST NEWS
(read more)
July 28th, 2018
Welcome
Prof. Shum Ping, Nanyang Technological University, Singapore (SPIE Fellow & OSA Fellow) to deliver a speech.
June 22nd, 2018
Papers accepted by ICTCE 2018 will be published by
ACM conference proceedings (ISBN: 978-1-4503-6585-7).
June 10th, 2018
Welcome
Prof. Bo Ai from Beijing Jiaotong University to deliver a speech.
May 5th, 2018
Welcome
Prof. Li Jie, Shanghai Jiao Tong University, China to deliver a speech.
April 20th, 2018
Welcome
Prof. Ma Maode from Nanyang Technological University, Singapore to deliver a speech.
April 1st, 2018
Welcome
IEEE Fellow Prof. Moshe Zukerman from City University of Hong Kong to deliver a speech.
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ABSTRACT
